The following inspection device "Xceed BSI"
A bottom inspection machine optimized for THT processes such as wave and selective soldering.
The "Xceed BSI" is a 3D AOI device designed to inspect the underside of a printed circuit board (PCB) without flipping it over, with the sensor head installed to face the bottom side. It can inspect PCBs that are wave or selective soldered. Since there is no need to flip the PCB, it eliminates unnecessary processes and minimizes the footprint of the device. 【Features】 ■ 3D AOI for underside PCB inspection ■ Space-saving due to no need for a flipping device ■ Complete compatibility with mirror solder joints using laser beams ■ Capable of inspecting SMDs, foreign objects, and dirt *For more details, please download the PDF or contact us.
- Company：パーミジャパン
- Price：Other
